期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (7)
This letter presents an efficient dual-band rectifier using stepped impedance stub matching circuit. Theoretical analysis of the dual-band impedance m......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (6)
A substrate-integrated waveguide (SIW)-based quad-channel diplexer operating in the 28- and 39-GHz bands is proposed for the first time. To allow a gr......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (6)
A novel arbitrary-order absorptive balanced filter is presented in this letter. It consists of an N-th order coupled-line bandpass filter with absorpt......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (4)
This letter proposes a new surrogate-based multiphysics optimization technique for microwave devices incorporating artificial neural networks (ANNs) a......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (5)
An ultralow power (ULP) low-noise receiver front-end for the BLE application is presented in this letter. The tradeoff between noise and power consump......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (7)
The behavior model based on the artificial neural network has been widely used in the broadband power amplifier (PA). Although the deep neural network......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (4)
Modeling the temperature-dependent nonlinearity of intrinsic capacitances in AlGaN/GaN high electron mobility transistors (HEMTs) improves model accur......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (5)
This letter presents a novel class of compact dual-mode bandpass filters based on half-mode substrate-integrated waveguide (HMSIW) cavities. By using ......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (9)
A new dual-band bandpass filter (BPF) is designed and fabricated based on a pair of spherical dual-mode resonant cavities using 3-D printing technolog......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (4)
In this letter, we propose a novel technique for rapid and accurate yield estimation of microwave passive components using model-order reduction (MOR)......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (8)
This letter presents a ring-shaped E-plane filtering coupler working at 150 GHz with high performance. The coupler is based on cavity resonators. Unli......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (6)
For bandpass simulation of nonreciprocal devices with fine and complex structures, hybrid implicit-explicit (HIE) perfectly matched layer (PML) which ......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (5)
A compact multifunctional switchable filter based on parallel-coupled lines with three different filtering functions is presented in this letter. By u......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (4)
This letter presents the design of compact tripleand quad-band power dividers (PDs) based on substrate integrated waveguide (SIW) technology. The prop......
期刊： IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021; 31 (8)
This letter presents a 230-GHz high-gain amplifier implemented in a 0.13-mu m SiGe BiCMOS technology. The amplifier consists of a single-ended cascode......
