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An improved scanning probe-based lithography: Site-controlled formation of self-assembled film as an etch mask

期刊: MICROELECTRONIC ENGINEERING, 2021; 244 ()

A self-assembled 1H,1H,2H,2H-perfluorodecyltriethoxysilane (PFDS) film was prepared on a diamond tip scratched silicon surface, and presented stronger......

Thermal stability of Mo-C alloy Schottky contacts on n-type 4H-SiC

期刊: MICROELECTRONIC ENGINEERING, 2021; 239 ()

In this work, we propose a Schottky diode that uses Mo-C alloy as a Schottky metal to form a Schottky contact. Unlike existing diode designs based on ......

Effects of polyethyleneimine, applied potential and the initial gap on the localized electrochemical deposition of silver microcolumns

期刊: MICROELECTRONIC ENGINEERING, 2021; 247 ()

Localized electrochemical deposition (LECD) is a promising and economical three-dimensional (3D) microstructure fabrication method. As the current res......

A novel process for adjusting the gate-drain spacing in InP-HEMTs with

期刊: MICROELECTRONIC ENGINEERING, 2021; 247 ()

To enable mass production of InP-HEMTs operating in microwave and THz bands with T shaped gates as narrow as 30 nm, industry friendly processes for so......

A method to increase line-density of grating based on PDMS stretching and PUA replication process

期刊: MICROELECTRONIC ENGINEERING, 2021; 247 ()

Grating plays an important role in many fields, so it is of great significance to develop a low-cost and rapid grating fabricating technology. In this......

Effects of heavy ion irradiation on Cu/Al2O3/Pt CBRAM devices

期刊: MICROELECTRONIC ENGINEERING, 2021; 247 ()

In this work, the effects of heavy ion irradiation on atomic switches with Cu/Al2O3/Pt structure are investigated. The initial device is prone to hard......

Multi-layered BTO/PVDF nanogenerator with highly enhanced performance induced by interlaminar electric field

期刊: MICROELECTRONIC ENGINEERING, 2021; 244 ()

The flexible piezoelectric nanogenerator (PNG) has been spotlighted as a promising candidate for sustainable power source in wireless portable device.......

Enhancement of polarization response in UVA and UVC wavelength with integrated sub-wavelength metal-grids

期刊: MICROELECTRONIC ENGINEERING, 2021; 242 ()

The sensitive detection of polarization-states of ultraviolet (UV) light is enssential for many optoelectronic applications, such as UV communication ......

Using a triblock copolymer as a single additive in high aspect ratio through silicon via (TSV) copper filling

期刊: MICROELECTRONIC ENGINEERING, 2021; 244 ()

Through silicon via (TSV) is a promising interconnect technology in three-dimensional (3D) integration which has large packing density, improves effic......

Temperature characteristics testing and modifying of piezoelectric composites

期刊: MICROELECTRONIC ENGINEERING, 2021; 242 ()

The current ceramic/618 epoxy resin piezoelectric composite material is easily deformed due to temperature, which affects the performance of the trans......

Fabrication of integrated silicon PIN detector based on Al-Sn-Al bonding for Delta E-E telescope application

期刊: MICROELECTRONIC ENGINEERING, 2021; 247 ()

The conventional monolithic integration of silicon PIN detector as Delta E-E telescope suffer from incompatibility with IC process, signal crosstalk, ......

Comparison of ratio of gate length to gate-drain distance influences on source access resistance of AlGaN/AlN/GaN HFETs at different temperatures

期刊: MICROELECTRONIC ENGINEERING, 2021; 247 ()

In this work, two AlGaN/AlN/GaN heterostructure field-effect transistors (HFETs) with different ratios of gate length (LG) to gate-drain distance (LGD......

Pre-deposition growth of interfacial SiO2 layer by low-oxygen-partial-pressure oxidation in the Al2O3/4H-SiC MOS structure

期刊: MICROELECTRONIC ENGINEERING, 2021; 244 ()

A novel thermal oxidation method for growing a thin SiO2 layer is proposed for improving the Al2O3/4H-SiC-based MOS structure characteristics. The met......

Characterization of AlN and AlScN film ICP etching for micro/ nano fabrication

期刊: MICROELECTRONIC ENGINEERING, 2021; 242 ()

We investigate the inductively coupled plasma (ICP) etching characteristics of (0002) Aluminum Nitride (AlN) and Aluminum Scandium Nitride (Al0.94Sc0.......

Mm-level ultra-thick folded waveguide structures fabricated by UV-LIGA for W-band TWTs

期刊: MICROELECTRONIC ENGINEERING, 2021; 247 ()

While the precision CNC milling method is widely used to fabricate relatively large sized folded waveguides (FWGs), especially W-band FWGs, UV-LIGA is......

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