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Numerical Modelling of Interconnect Electromigration Under Non-DC Stressing Conditions

Wu, ZY; Li, C; Zhao, ZB; Yang, YT

Wu, ZY (corresponding author), Xidian Univ, Sch Microelect, Minist Educ Band Gap Semicond Mat & Devices, Key Lab, Xian 710071, Peoples R China.

IETE JOURNAL OF RESEARCH, 2020; 66 (1): 85

Abstract

A numerical model of the equivalent time conversion to DC stressing for electromigration failures under various current waveforms is proposed based on......

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