Effect of curing pressure on the curing behavior of an epoxy system: Curing kinetics and simulation verification-MedSci.cn - 梅斯（MedSci）

Effect of curing pressure on the curing behavior of an epoxy system: Curing kinetics and simulation verification

Liang, Q; Feng, XP; Zhang, K; Hui, XM; Hou, X; Ye, JR

Hou, X (通讯作者)，Northwestern Polytech Univ, Sch Astronaut, Xian 710072, Peoples R China.;Hou, X; Ye, JR (通讯作者)，Beijing Inst Technol, Sch Aerosp Engn, Beijing 100081, Peoples R China.

POLYMER, 2022; 256 ():

科室
- - 订阅+
  - 更多科室
工具
服务