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Bas-Relief Modeling from Normal Layers

Wei, MQ; Tian, Y; Pang, WM; Wang, CCL; Pang, MY; Wang, J; Qin, J; Heng, PA

Wang, J (reprint author), Nanjing Univ Aeronaut & Astronaut, Nanjing 211106, Jiangsu, Peoples R China.

IEEE TRANSACTIONS ON VISUALIZATION AND COMPUTER GRAPHICS, 2019; 25 (4): 1651

Abstract

Bas-relief is characterized by its unique presentation of intrinsic shape properties and/or detailed appearance using materials raised up in different......

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