Baidu
map

Electromigration behavior of silver thin film fabricated by electron-beam physical vapor deposition

Jin, Z; Shen, YA; Huo, FP; Chan, YC; Nishikawa, H

Jin, Z (corresponding author), Osaka Univ, Grad Sch Engn, Suita, Osaka, Japan.; Jin, Z; Nishikawa, H (corresponding author), Osaka Univ, Joining & Welding Res Inst JWRI, Ibaraki 5600047, Japan.; Shen, YA (corresponding author), Feng Chia Univ, Dept Mat Sci & Engn, Taichung 407, Taiwan.

JOURNAL OF MATERIALS SCIENCE, 2021; 56 (16): 9769

Abstract

Electromigration (EM) is considered as a serious issue that threatens the reliability of electronic packaging. For the long-term reliability of the ap......

Full Text Link


Baidu
map
Baidu
map
Baidu
map