Development of a bipolar electrostatic chuck with a compliant beam-array assembly having four 3D-printed layers for large film handling-MedSci.cn - 梅斯（MedSci）

Development of a bipolar electrostatic chuck with a compliant beam-array assembly having four 3D-printed layers for large film handling

Taoka, Y; Hayashi, T; Hemthavy, P; Takahashi, K; Saito, S

Taoka, Y (通讯作者)，Tokyo Inst Technol, Meguro Ku, I1-48,2-12-1 Ookayama, Tokyo 1528550, Japan.

ENGINEERING RESEARCH EXPRESS, 2022; 4 (1):

科室
- - 订阅+
  - 更多科室
工具
服务