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Local Stress Field in Wafer Thinning Simulations with Phase Space Averaging

Wang, MC; Huang, YH; Li, JM; Xu, L; Zhu, FL

Zhu, FL (corresponding author), Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan 430074, Peoples R China.

CMC-COMPUTERS MATERIALS & CONTINUA, 2021; 68 (1): 743

Abstract

From an ingot to a wafer then to a die, wafer thinning plays an important role in the semiconductor industry. To reveal the material removal mechanism......

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