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Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages

Kung, HK; Hsieh, CL

Kung, HK (reprint author), Cheng Shiu Univ, Inst Mechatron Engn, Kaohsiung 83347, Taiwan.

JOURNAL OF ELECTRONIC PACKAGING, 2017; 139 (4):

Abstract

Overhang and/or pyramid stacked packages are the trend in the semiconductor industry. As the stacked layers increase drastically, the wire sweep and w......

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