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Effect of deposition potential on the microstructure and corrosion resistance of Ni-Cu alloys in ChCl-EG ionic liquids

Zhan, CB; Zhang, RJ; Fu, X; Sun, HJ; Wang, BJ; Sun, J

Sun, J (通讯作者),Shenyang Ligong Univ, Sch Environm & Chem Engn, Shenyang, Peoples R China.

JOURNAL OF APPLIED ELECTROCHEMISTRY, 2023; 53 (11): 2137

Abstract

Using a constant potential electrodeposition technique, bright Ni-Cu alloy plating coating was made directly on a purple copper substrate from choline......

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