Heterogeneous Integration with 3D Chiplets-MedSci.cn - 梅斯（MedSci）

Heterogeneous Integration with 3D Chiplets

Kulkarni, D

Kulkarni, D (通讯作者)，AMD Inc, Santa Clara, CA 95054 USA.

2023 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI-TSA/VLSI-DAT, 2023; ():

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