Modeling of Cu-Cu Thermal Compression Bonding-MedSci.cn

Modeling of Cu-Cu Thermal Compression Bonding

Shie, KC; Tran, DP; Gusak, AM; Tu, KN; Liu, HC; Chen, C

Chen, C (通讯作者)，Natl Yang Ming Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan.