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Dielectric Behavior of an Electrically Conductive Metal-Particle Thick Film

Thomas, GC; Chung, DDL

Chung, DDL (通讯作者),Univ Buffalo State Univ New York, Dept Mech & Aerosp Engn, Composite Mat Res Lab, Buffalo, NY 14260 USA.

JOURNAL OF ELECTRONIC MATERIALS, 2022; 51 (6): 3005

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