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Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding

Li, JJ; Liang, Q; Shi, TL; Fan, J; Gong, B; Feng, C; Fan, JH; Liao, GL; Tang, ZR

Tang, ZR (reprint author), Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R China.

JOURNAL OF ALLOYS AND COMPOUNDS, 2019; 772 (): 793

Abstract

In this paper, new type Cu nanoaggregates (Cu NAs) were designed, and the Cu-Cu bonding by Cu NAs was investigated. The Cu NAs were obtained by agglom......

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