IC Packaging: 3D IC Technology and Methods-MedSci.cn

IC Packaging: 3D IC Technology and Methods

Kumar, A; Verma, G; Nath, V; Choudhury, S

Kumar, A (reprint author), Univ Petr & Energy Studies UPES, Dept Elect Instrumentat & Control Engn, Dehra Dun, Uttar Pradesh, India.