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Surface Self-nanocrystallization in Copper Electroforming

Shen, CJ; Zhu, ZW; Zhu, D

Zhu, D (reprint author), Nanjing Univ Aeronaut & Astronaut, Coll Mech & Elect Engn, Nanjing 210016, Jiangsu, Peoples R China.; Zhu, D (reprint author), Jiangsu Key Lab Precis & Micromfg Technol, Nanjing, Jiangsu, Peoples R China.

JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2019; 28 (1): 211

Abstract

The coarse columnar grain layer generated on top of electroforming deposits leads to low surface strength and poor global performance of deposits. Her......

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