A feasibility study on potential of stress sensors to detect solder joint defects toward prognostics of power modules-MedSci.cn - 梅斯（MedSci）

A feasibility study on potential of stress sensors to detect solder joint defects toward prognostics of power modules

Usui, M; Kuwahara, M; Satoh, T

Usui, M (通讯作者)，Toyota Cent Res & Dev Labs Inc, 41-1 Yokomichi, Nagakute, Aichi 4801192, Japan.

MICROELECTRONICS RELIABILITY, 2022; 137 ():

科室
- - 订阅+
  - 更多科室
工具
服务