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Analysis of Thin Film Parylene-Metal-Parylene Device Based on Mechanical Tensile Strength Measurement

Seok, S; Park, H; Choi, W; Kim, O; Kim, J

Seok, S (reprint author), Univ Paris Saclay, C2N, Orsay, France.

SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS (DTIP 2019), 2019; ():

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