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Joint Feature and Label Adversarial Network for Wafer Map Defect Recognition

Yu, JB; Shen, ZL; Zheng, XY

Yu, JB (corresponding author), Tongji Univ, Sch Mech Engn, Shanghai 200084, Peoples R China.

IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, 2021; 18 (3): 1341

Abstract

Deep neural networks (DNNs), e.g., convolutional neural network (CNN), are able to learn effective features from wafer maps for dimensional reduction ......

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