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Using Compressive Sampling to Fill Interbatch Data Gap From Low-Cost IoT Vibration Sensor

Ooi, BY; Beh, WL; Kh'ng, XY; Liew, SY; Shirmohammadi, S

Ooi, BY (通讯作者),Univ Tunku Abdul Rahman Kampar, Fac Informat & Commun Technol, Dept Comp Sci, Kampar 31900, Malaysia.

IEEE INTERNET OF THINGS JOURNAL, 2022; 9 (12): 9820

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