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Twin ECC: A Data Duplication Based ECC for Strong DRAM Error Resilience

Bae, HK; Chung, MJ; Gong, YH; Chung, SW

Bae, HK (通讯作者),Korea Univ, Dept Comp Sci & Engn, Seoul 02841, South Korea.

2023 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, DATE, 2023; ():

Abstract

With the continuous scaling of process technology, DRAM reliability has become a critical challenge in modern memory systems. Currently, DRAM memory s......

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