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A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC

Ni, TM; Xu, Q; Huang, ZF; Liang, HG; Yan, AB; Wen, XQ

Yan, AB (corresponding author), Anhui Univ, Sch Comp Sci & Technol, Hefei 230039, Peoples R China.

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2021; 40 (9): 1952

Abstract

Due to the winding level of the thinned wafers and the surface roughness of silicon dies, the through-silicon vias (TSVs) defect tend to be clustered,......

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