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The effect of tricyclazole as a novel leveler for filling electroplated copper microvias

Liao, CH; Zhang, ST; Chen, SJ; Qiang, YJ; Liu, G; Tang, MX; Tan, BC; Fu, DL; Xu, Y

Zhang, ST (reprint author), Chongqing Univ, Sch Chem & Chem Engn, Chongqing 400044, Peoples R China.

JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 2018; 827 (): 151

Abstract

Tricyclazole (TCA), a nitrogen-containing heterocyclic compound, is employed as potential leveler for microvia filling with electroplating copper. The......

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