Thermal fatigue reliability improvement of leadless ceramic chip carrier solder joints-MedSci.cn - 梅斯（MedSci）

Thermal fatigue reliability improvement of leadless ceramic chip carrier solder joints

Chen, YL; Li, F; Li, K; Li, X; Liu, M; Liu, G

Chen, YL (通讯作者)，Xian Microelect Technol Inst, Xian 710071, Peoples R China.

MICROELECTRONICS RELIABILITY, 2022; 132 ():

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