Correction factors to strength of thin silicon die in three- and four-point bending tests due to nonlinear effects-MedSci.cn - 梅斯（MedSci）

Correction factors to strength of thin silicon die in three- and four-point bending tests due to nonlinear effects

Tsai, MY; Huang, PS

Tsai, MY (通讯作者)，Chang Gung Univ, Dept Mech Engn, Taoyuan, Taiwan.

MICROELECTRONICS RELIABILITY, 2022; 128 ():

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