投稿信息
投稿信息
审稿周期
投稿命中率
审稿费用
暂无数据
版面费用
暂无数据
中国人发表比例
2023年中国人文章占该期刊总数量暂无数据 (2022年为100.00%)
自引率
13.3 %
年文章数
1068
作者需知
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NCBI查询
偏重的研究方向
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期刊简介
稿件收录要求
稿件收录要求
Plasma Chemistry and Plasma Processing is an international journal for the publication of original papers on fundamental research and new developments in plasma chemistry and plasma processing. The broad coverage of experimental analytical and numerical studies includes both non-equilibrium ('cold') and equilibrium ('hot') plasmas. Pertinent diagnostic studies are also encouraged. Typical subject areas are: etching deposition of thin films and protective coatings annealing polymerization preparation of amorphous and crystalline materials surface modification techniques for making electronic devices and techniques for analytical chemistry. Other topics of interest include volume reactions in inorganic and organic systems thermal plasma synthesis metallurgy fuming coal gasification and desulfurization spheroidization spraying surfacing and modeling of plasma reactors.
