GetPortalImpactFactorByIdResp(projectId=1, id=6de94678, cover=https://img.medsci.cn/images/journal/cover/2021/Ccg_202109271315598080.jpg, fullname=MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, abbr=MAT SCI SEMICON PROC, pyear=暂无数据, frequence=Bimonthly, articleNumbers=3752, citedSelf2015=5.0, acceptanceRate=null, submissionToAcceptance=null, averageReviewTime=平均2.25月, reviewFee=null, pageFee=null, publishedRatio=2023年中国人文章占该期刊总数量暂无数据 (2022年为100.00%), issn=1369-8001, greenSci=https://www.greensci.net/search?kw=1369-8001, scijournal=https://www.scijournal.org/impact-factor-of-MAT-SCI-SEMICON-PROC.shtml, medsciHotlightString=null, medsciHotlightRealtime=3.562, medsciHotlight=4.438, medsciHotlight5year=5.06695, citescore=8.0, hIndex=60, impactFactor=4.1, orgnization=Elsevier Ltd., orgnizationUrl=http://www.elsevier.com, country=United Kingdom, countryCn=英国, isOa=0, isOaString=否, sciScie=Science Citation Index|Science Citation Index Expanded|Current Contents - Physical, Chemical & Earth Sciences|Current Contents - Engineering, Computing & Technology, bigclassCas=工程技术 3区, smallclassCas=工程技术 3 区, website=https://www.elsevier.com/wps/find/journaldescription.cws_home/600849/description#description, websiteHits=4975, guideForAuthor=null, guideForAuthorHits=1, submitWebsite=https://www.editorialmanager.com/mssp/|https://www.editorialmanager.com/mssp/, submitWebsiteHits=3048, content=<p>Published by Elsevier Science. ISSN: 1369-8001.<br /><br />Materials Science in Semiconductor Processing provides a unique and much needed forum for the discussion of experimental and theoretical materials research stimulated by and applied to semiconductor processing. Each issue will aim to provide a snapshot of current comprehension, new achievements, breakthroughs and future trends in such fields as ion implantation, diffusion and gettering, process and equipment modelling, metallization and interconnects, packaging, etc, which are the backbone of semiconductor device processing. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation for dopant engineering; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; ultra low energy implantation: physics, limitations and perspectives; gettering procedures for ULSI; advanced metallization and interconnects schemes; thin dielectric layer, oxidation; cleaning procedures for ULSI devices; compound semiconductor processing; physical modelling of processing (ion implantation, metal deposition, oxidation, etching, etc.): molecular dynamics, ab-initio methods, Monte Carlo, etc.; new physical models in commercial simulation platforms for the design and modelling of advanced devices; equipment modelling; new materials and processes for discrete and integrated circuits; heterostructures and quantum devices; engineering of the electrical and optical the properties of semiconductors; crystal growth: mechanisms, reliability, defect density intrinsic impurities and defects.</p>, totalCites=15385, brief=MAT SCI SEMICON PROC杂志工程技术行业,“<strong><a target="_blank" href="/sci/index.do?smallclass=材料科学:综合" >材料科学:综合</a></strong>”子行业的偏低级别杂志, articleType=绝大部分收录论著,也接收少量其它类型文章, medsciHeat=黑红, medsciComment=MAT SCI SEMICON PROC在该细分领域可能是一流杂志,可能是创刊时间短或不是热门学科,整体来说,国内学者关注度仍然不够。对于投稿而言,建议多向"&abbr&"投稿,当然期刊也应该加强品牌宣传。, medsciExplanation=MedSci期刊指数是根据中国科研工作者(含医学临床,基础,生物,化学等学科)对SCI杂志的认知度,熟悉程度,以及投稿的量等众多指标综合评定而成。当然,具体的,您还可以结合“<a href='//m.capotfarm.com/sci/submit.do?id=6de94678'>投稿经验系统</a>”,进行综合判断,这更是大家的实战经验,值得分享和参考。<br>
注意,上述MedSci期刊指数采用MedSci专利技术,由计算机系统自动计算,并给出建议,存在不准确的可能,仅供您投稿选择杂志时参考。, tags=[ImpactFactorTagDto(id=42516, tagName=太阳能光伏, createdHits=1), ImpactFactorTagDto(id=41164, tagName=材料物理, createdHits=1), ImpactFactorTagDto(id=42517, tagName=器件物理, createdHits=1), ImpactFactorTagDto(id=37686, tagName=纳米材料, createdHits=1), ImpactFactorTagDto(id=42842, tagName=氧化物半导体, createdHits=1), ImpactFactorTagDto(id=41623, tagName=发光材料, createdHits=1), ImpactFactorTagDto(id=42710, tagName=光催化, createdHits=1)], citeScoreList=[GetImpactFactorCiteScoreListResponse(year=2017, citescore=2.53), GetImpactFactorCiteScoreListResponse(year=2018, citescore=2.83), GetImpactFactorCiteScoreListResponse(year=2019, citescore=5.3), GetImpactFactorCiteScoreListResponse(year=2020, citescore=5.9), GetImpactFactorCiteScoreListResponse(year=2023, citescore=8.0)], medsciIndexList=[GetImpactFactorMedsciIndexListResponse(year=2020, medsciHotlight=4.166), GetImpactFactorMedsciIndexListResponse(year=2021, medsciHotlight=4.482), GetImpactFactorMedsciIndexListResponse(year=2022, medsciHotlight=4.663), GetImpactFactorMedsciIndexListResponse(year=2023, medsciHotlight=3.812), GetImpactFactorMedsciIndexListResponse(year=2024, medsciHotlight=3.562)], citeScoreGradeList=[GetImpactFactorCiteScoreGradeResponse(smallClass=Engineering - Mechanical Engineering , rank=104/579), GetImpactFactorCiteScoreGradeResponse(smallClass=Engineering - Mechanics of Materials , rank=77/352), GetImpactFactorCiteScoreGradeResponse(smallClass=Physics and Astronomy - Condensed Matter Physics , rank=84/397), GetImpactFactorCiteScoreGradeResponse(smallClass=Materials Science - General Materials Science , rank=115/439)], totalJcrAreaList=[GetImpactFactorCiteScoreGradeResponse(smallClass=ENGINEERING, ELECTRICAL & ELECTRONIC, rank=Q2), GetImpactFactorCiteScoreGradeResponse(smallClass=MATERIALS SCIENCE, MULTIDISCIPLINARY, rank=Q2), GetImpactFactorCiteScoreGradeResponse(smallClass=PHYSICS, APPLIED, rank=Q2), GetImpactFactorCiteScoreGradeResponse(smallClass=PHYSICS, CONDENSED MATTER, rank=Q3)], pmcUrl=https://www.ncbi.nlm.nih.gov/nlmcatalog?term=1369-8001[ISSN], pubmedUrl=https://www.ncbi.nlm.nih.gov/pubmed?cmd=search&term=MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING[ta], article_number=764, article_number_cn=282, earlyWarning=, linkOutUrl=null, isJournalMember=false, unscrambleContent=null, dayViewCount=false, endexampletyle=暂无数据)
期刊名称
MAT SCI SEMICON PROC/MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Science Citation Index|Science Citation Index Expanded|Current Contents - Physical, Chemical & Earth Sciences|Current Contents - Engineering, Computing & Technology