期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (8)
This article presents a 4x time-interleaved (TI) 2nd-order discrete-time (DT) delta-sigma modulator (DSM). We propose a digital feed-forward extrapola......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (5)
Physically unclonable function (PUF) has been increasingly used as a promising primitive for hardware security with a wide range of applications in th......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (6)
The emerging edge intelligence requires low-cost energy-efficient neural network (NN) processors. Supporting various types of edge NN models leads to ......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (9)
This article presents a hybrid single-inductor bipolar-output (SIBO) dc-dc converter for active-matrix organic light-emitting diode (AMOLED) displays,......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (9)
This article presents a 6.78-MHz single-stage dual-output regulating rectifier for miniaturizing the true wireless devices. The proposed rectifier top......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (7)
This article presents a monolithic hybrid boost converter suitable for a high conversion ratio (CR). It uses two inductors, two cross-connected flying......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (6)
This article presents a successive approximation register (SAR)-assisted noise-shaping (NS) pipeline analog-to-digital converter (ADC) incorporating v......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (6)
This article presents a leakage cancellation architecture for single-antenna frequency-modulated continuous-wave (FMCW) radars at W-band. A shared ant......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (7)
This article presents a wireless multi-channel sensor interface circuit for emerging e-skin applications. The proposed interface circuit uses a CDMA-l......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (9)
This article presents a computing-in-memory (CIM) structure aimed at improving the energy efficiency of edge devices running multi-bit multiply-and-ac......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (5)
CMOS-integrated in-band full-duplex (IBFD) operation in wireless links and cryogenic quantum platforms was previously enabled by magnetic-free circula......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (8)
An ultrawideband millimeter-wave (mm-Wave) and subterahertz (sub-THz) signal generator is proposed leveraging a varactor-less quad-band voltage-contro......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (6)
We present an area- and power-efficient application-specific integrated circuit (ASIC) for a miniaturized 3-D ultrasound system. The ASIC is designed ......
期刊： IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2021; 56 (5)
This article presents the design of a dual-mode V-band power amplifier (PA) that enhances the efficiency at power back-off (PBO) using load modulation......
