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Deformable Convolutional Networks for Efficient Mixed-Type Wafer Defect Pattern Recognition

Wang, JL; Xu, CQ; Yang, ZL; Zhang, J; Li, XO

Zhang, J (corresponding author), Donghua Univ, Coll Mech Engn, Shanghai 201620, Peoples R China.

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2020; 33 (4): 587

Abstract

Defect pattern recognition (DPR) of wafer maps is critical for determining the root cause of production defects, which can provide insights for the yi......

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