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Influence of slurry components on copper CMP performance in alkaline slurry

Xu, QZ; Chen, L; Yang, F; Cao, H

Xu, QZ; Chen, L (reprint author), Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China.

MICROELECTRONIC ENGINEERING, 2017; 183 ( ): 1

Abstract

In this work, we have designed copper chemical mechanical planarization (CMP) experiments to investigate the effect of slurry components on the planar......

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