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Stress Analysis and Characterization of PECVD Oxide/Nitride Multi-Layered Films After Thermal Cycling

Chen, KS; Tsai, YG; Yang, TH

Chen, KS (corresponding author), Natl Cheng Kung Univ, Dept Mech Engn, Tainan 70101, Taiwan.

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (1): 17

Abstract

Chemically deposited multiple layer films are common structures in microelectronics and MEMS devices and their stress states directly influence both t......

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