期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (3)
Phase-change memory (PCM) as emerging non-volatile memory has attracted more attention and considered as the promising replacement of the main memory.......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (3)
This paper presents experimental and numerical analysis of a buried P-pillar (BP) lateral double-diffused metal-oxide semiconductor (LDMOS) fabricated......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (3)
The multichip power module is a popular application for large-capacity and high-frequency converters. However, the existence of an asymmetric circuit ......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (3)
On-chip electrostatic discharge (ESD) protection is becoming more challenging for integrated circuits (ICs) made in advanced technology nodes. The ESD......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (3)
The effect of proton irradiation on the electrical properties of AlGaN/GaN high electron mobility transistors (HEMTs) with hydrogen treatment is studi......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (3)
The reverse breakdown characteristics of 4H-SiC Junction Barrier Schottky (JBS) rectifiers adopting the different floating limiting rings (FLRs) termi......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (3)
With the technology scaling down, the single event transients produced in the combinational circuit lead to an increasing threat to reliability. In th......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (2)
3D triple-level cell (TLC) NAND flash based solid state drive (SSD) is gradually becoming the dominant storage media in large-scale storage systems du......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (3)
In this work, three MISHEMT devices with different electric-field-dispersion layer (EDL) behave the same pristine electrical properties. EDL, which is......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (3)
In response to the rapid development of wireless communication, enhancement of temperature stability and power durability for surface acoustic wave (S......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (2)
As the operating conditions are getting harsher, the failure analysis of Phase Change Memory (PCM) are getting more and more important. In this work, ......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (3)
The reliability of the integrated circuits (ICs) has become one of the greatest challenges with the increasing complexity of the electromagnetic envir......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (1)
Chemically deposited multiple layer films are common structures in microelectronics and MEMS devices and their stress states directly influence both t......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (1)
Due to the severe air pollution, printed circuit boards (PCB) in electronic products are apt to be covered by airborne dust deposition. The trace amou......
期刊： IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021; 21 (1)
The base component of radiation-hardened flash-based field-programmable gate arrays (FPGAs) is a reconfigurable memory cell, which is reliable and has......
