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Reconstituted Wafer Deformation Analysis Through Whole Process Emulation

Yang, CY; Chen, KS; Yang, TS

Chen, KS (corresponding author), Natl Cheng Kung Univ, Dept Mech Engn, Tainan 70101, Taiwan.

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2020; 20 (1): 172

Abstract

Wafer reconstitution is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and packaging. Through ......

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