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A simulating method of moisture continuous diffusion under changing temperatures and analysis of moisture-induced stresses covering moisture desorption and reflow processes for the QFN

Shi, XH; Qiu, YY; Jia, F; Ma, HB

Qiu, YY (corresponding author), Xidian Univ, Sch Mechanoelect Engn, Xian 710071, Peoples R China.

MICROELECTRONICS RELIABILITY, 2021; 119 ():

Abstract

Moisture in the atmosphere could diffuse into plastic packaging devices, which would cause high hygro-mechanical stress and vapor stress and lead irre......

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