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Hydrogen thermal reductive Cu nanowires in low temperature Cu-Cu bonding

Du, L; Shi, TL; Su, L; Tang, ZR; Liao, GL

Liao, GL (reprint author), Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R China.

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2017; 27 (7):

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