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Stress/strain characterization in electronic packaging by micro-Raman spectroscopy: A review

Ma, LL; Qiu, W; Fan, XJ

Qiu, W (corresponding author), Tianjin Univ, Dept Mech, Tianjin 300350, Peoples R China.; Fan, XJ (corresponding author), Lamar Univ, Dept Mech Engn, Beaumont, TX 77710 USA.

MICROELECTRONICS RELIABILITY, 2021; 118 ():

Abstract

In this review, a review a of the applications of micro-Raman spectroscopy (?RS) to characterize the residual strain and/or stress in electronic packa......

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